Despite U.S. sanctions making it difficult for China to obtain the equipment needed to manufacture the world's most advanced chips, Chinese tech giant Huawei still expects to design high-end chips with transistor densities equivalent to the 1.4nm process by 2031.
According to a combined report from People's Daily Client and Reuters, the 2026 International Symposium on Circuits and Systems was held in Shanghai on Monday (May 25), where He Tingbo, Huawei's Director and President of its Semiconductor Business Unit, officially unveiled the "Tao's Law" in her keynote speech. This is the first time China has proposed a new principle to guide industry development in the global semiconductor field.
Based on this law, Huawei has successfully designed and mass-produced 381 chips over the past six years. This fall, Huawei will release a new Kirin mobile chip that will fully adopt logic folding technology, significantly improving related performance.
According to reports, "Tao's Law" establishes a multi-level collaborative optimization system spanning devices, circuits, chips, and systems. By 2031, it is expected that high-end chips developed under this law will reach transistor densities equivalent to the 1.4nm process.
Although Huawei did not provide independent performance data, this target remains significant because by the end of this century, the 1.4nm process is expected to be at the forefront of advanced global chip manufacturing.